Thermistor Onboard Type
|
Series
|
Type
|
Termination
|
Operating temperature range |
Resistance range |
|
|
SMD chip
|
Tin plating
|
-40ºC~+100ºC |
25Ω~2KΩ |
| TN05,TC05,TH05 |
-40ºC~+125ºC |
30Ω~2MΩ |
| TN11, TH11 |
10kΩ~1MΩ |
| TN10,TC10 |
30Ω~150kΩ |
| TN20,TC20,TH20 |
40Ω~2MΩ |
| SC05 |
47Ω~2kΩ |
|
|
1kΩ~10kΩ |
| MN18,MH18 |
MELF |
Tin plating |
-40ºC~+150ºC |
2kΩ~150kΩ |
| FH05,FH10 |
Flake chip |
Au Electrode
|
-40ºC~+125ºC |
10kΩ,100kΩ |
| CN25, CH25 |
Radial leaded |
Pb-free
soldered
Cu-Ni
wire
|
-40ºC~+110ºC |
500Ω~1MΩ |
| RM16, RH16 |
Polyurethane covered wire |
1kΩ~1MΩ |
| PH08 |
Polyurethane covered wire |
-40ºC~+85ºC |
10kΩ,100kΩ |
| BN35 |
PVC covered wire
|
-40ºC~+80ºC |
10kΩ |
| DC30 |
Pb-free soldered Cu-Ni wire |
-40ºC~+100ºC |
300Ω~200kΩ |
| GR15 |
Dumet wire |
-40ºC~+300ºC(+150ºC) |
10kΩ~10MΩ |
| GA13, GH13 |
Axial leaded |
Ni-plating or
Tin plating |
-40ºC~+300ºC&
-40ºC~+150ºC |
2kΩ~1MΩ |
| GA20, GH20 |
2kΩ~1MΩ |
■ Part number system
|
TN05
|
3T
|
103
|
J
|
B
|
|
|
|
|
|
|
|
Series
|
B
Value
|
Resistance
|
Resistance
tolerance
|
Packing
form
|
| |
|
(1)
|
(2)
|
(3)
|
(1) Resistance value at 25°C is expressed in ohms.
First two digits are
significant and the last
digit is the numbers
of zeros following.
(2) Resistance tolerance.
(3)
Packing form

Code
|
Packing
Form
|
Packing
Qty.
|
Related series |
B
|
Bulk
|
500
|
TS03, TC03, TH03, TN05, TC05,
TH05, TN10, TC10, TN11, TH11,
TN20, TC20, TH20, SC05, SC10
|
200
|
MN18,
MH18, GA13, GH13,
GA20, GH20
CN25, CH25, RM16, RH16, PH08, GR15
|
100
|
DC30
|
C
|
Plastic
Tray
|
400
|
FH05,
FH10
|
T
|
Paper
taping
|
4,000
|
TN11,
TH11, TN10, TC10,
TN20, TC20, TH20,
SC10
|
P
|
Plastic
taping
|
2,000
|
MN18,
MH18
|
F
|
Flat
pack
|
2,000
|
GA13,
GH13, GA20, GH20,
DC30
|
R
|
Paper
taping
|
10,000
|
TN05,
TC05, TH05, SC05
|
D
|
15,000
|
TS03, TC03, TH03
|
· R-T properties for
SMD parts
· Applications
· Packing form
· Caution
in Chip
Thermister usage
· Mounting conditions
|