■ Caution in Chip Thermister usage
• Operating
Power
Thermistors shall not be operated in excess of the specified
Maximum permissible electrical power" in the specifications.
Unless the thermistors are operated under the specified
Maximum permissible electrical power, it may cause burnout
and damage due to thermal run away.
Fully check safety and reliability in your circuit.
• Operating
Conditions
Do not use the thermistors under the following conditions
because all these factors deteriorate the thermistor
characteristics or cause failures and burnout.
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Wet or humid locations
Corrosive or deoxidizing gas(Hydrogen sulfide, Sulfurous acid, Chloride and
ammonia, etc.)
Volatile or flammable gas
Dusty conditions
Under high pressure or low pressure
locations with salt water, oils, chemical liquids or organic solvents
Strong vibrations or mechanical impact
Other places similar to the hazardous conditions mentioned above |
Be sure to provide an appropriate fail-safe function
on your product to prevent secondary damages that may
be caused by the failure of our product.
• Safety
precaution
Our products shall be used for general purpose
applications required for consumer type electronics equipment.
Strongly recommend to consult
us before use of our product, if you think about use
of our products on the following special applications
with high level of safety.
·
Medical
equipment, ·Aircraft equipment, Aerospace equipment, ·Atomic
power equipment, etc.
• Storage
conditions
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Storage temperature and humidity
Temperature : -10 to +40 degree C
Humidity : less than 70%RH(not dewing condition)
Storage term
Use our product within 12 months after delivery.
Handling after unpacking
After unpacking, reseal products or store them in a sealed package with a dry
agent.
Storage place
Do not store our products in direct sunlight or in corrosive gas(sulfuricacid
or chlorine gas, etc.) |
• Soldering
and mounting notice
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Use recommended dimensions of lands and the
dimensions shall be symmetrical.
Use rosin-based flux. Do not use strong acid flux with halide content over 0.2wt%.
Do not use ultrasonic cleaning with too much output to avoid deteriorating the
strength of the terminal electrodes or cracking in the solder and/or ceramic
bodies
of the products. The followings are recommended conditions for ultrasonic cleaning.
Frequency : less than 40 kHz
Output : less than 20 W/L
Cleaning time : less than 5 min
Too much soldering may cause mechanical stress resulting in cracking.
The amount of solder shall be controlled according to the standard height of
fillet
shown below.
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Choose a mounting position that minimizes the
stress imposed on the chip during bending of the
board.
Since dividing or breaking of the PC boards may cause mechanical stress in the
thermistors on the PC boards, it shall be done carefully by using a jig to prevent
the product from mechanical damage. |
• Other
caution
Use this product within the specified temperature
range. Feel free to contact us when you have any questions
regarding our products.
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