Series |
Soldering conditions |
TS03
TC03
TH03
TN05
TC05
TH05
TN11
TH11
TN10
TC10
TN20
TC20
TH20
SC05
SC10
MN18
MH18
GA13*1
GA20*1
GH13*1
GH20*1
|
 |
| 1) |
Time shown in the above figures
is measured from the point when
chip surface reaches temperature. |
| 2) |
Temperature difference in high
temperature part should be within
100ºC. |
| 3) |
After soldering, do not force
cool, allow the parts to cool
gradually. |
|
|
1)
|
Time shown in the above figures
is measured from the point when
chip surface reaches temperature. |
| 2) |
Temperature difference in high
temperature part should be within
110ºC. |
| 3) |
After soldering, do not force
cool, allow the parts to cool
gradually. |
|
*1 GA13,GA20,GH13,GH20 are Tin plated only. and flow only.
Soldering method of the other products refer to the individual specification. |
|
|
General attention to soldering
| • |
High soldering temperatures and long soldering times can
cause leaching of the termination, decrease in adherence
strength, and the change of characteristic may occur. |
| • |
For soldering, please refer to the soldering curves above. |
| • |
Please use a mild flux(containing less than 0.2wt% C ). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components, that could affect resistance. |
Cleaning
| • |
When using ultrasonic cleaning, the board may resonate
if the output
power is too
high. Since
this vibration can cause cracking or a decrease in the adherence
of the termination,
we recommend
that you use
the conditions
below.
| Frequency: |
40kHz max. |
| Output power: |
20W/Liter |
| Cleaning time: |
5minutes max. |
|
|
