Series |
Soldering conditions |
CSA20
CSA30
CSZ30
CSA70
|
 |
| 1) |
Time shown in
the above figures is measured from
the point when chip surface reaches
temperature. |
| 2) |
Temperature difference
in high temperature part should
be within 100ºC. |
| 3) |
After soldering,
do not force cool, allow the parts
to cool gradually. |
|
|
1)
|
Time shown in
the above figures is measured from
the point when chip surface reaches
temperature. |
| 2) |
Temperature difference
in high temperature part should
be within 110ºC. |
| 3) |
After soldering,
do not force cool, allow the parts
to cool gradually. |
|
|
|
|
General attention to soldering
| • |
High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change of characteristic may occur.
|
| • |
For soldering, please refer to the soldering curves above.
However, please keep exposure to temperatures exceeding 200ºC to under 50 seconds. |
| • |
Please use a mild flux(containing less than 0.2wt% C ). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components, that could affect resistance. |
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below.
• Frequency:40kHz max.
• Output power:20W/Liter
• Cleaning time:5minutes max.
|
