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■ Recommended Land Pattern.
1. LZA05, LZA10
|
Type
|
LZA05 |
LZA10
|
Size
|
1.0×0.5 |
1.6×0.8
|
A
|
0.4 |
0.7
|
B
|
1.4 |
2.0
|
C
|
0.5 |
0.7
|
|
2. LFA10, LCA10,LFB10
Connection
to ground pattern
via through hole
recommended (LFA10)
|
|
Type
|
LCA10
LFA10
LFB10
|
|
Size
|
1.6×0.8
|
|
A
|
1.15
|
|
B
|
0.45
|
|
C
|
1.6
|
D |
0.8 |
E |
2.5 |
F |
0.6 |
G |
0.4 |
|
3. LCA20, LFA20, LFB20 LFA30, LFB30
|
|
|
Type
|
LCA20
LFA20
LFB20 |
LFA30
LFB30
|
|
Size
|
2.0×1.25 |
3.2×1.6
|
|
A
|
0.6 |
1.3
|
|
B
|
1.5 |
2.3
|
|
C
|
1.0 |
1.3
|
|
|
|
Type
|
LCA20
LFA20
LFB20 |
LFA30
LFB30
|
|
Size
|
2.0×1.25 |
3.2×1.6
|
|
A
|
0.6 |
1.3
|
|
B
|
0.8 |
1.5
|
|
C
|
1.5 |
2.3
|
|
D
|
1.0 |
1.3
|
|
E
|
2.2 |
3.0
|
|
F
|
0.6 |
0.6
|
|
4. LCA14, LCG14, LFA24, LFH24, LCA24, LFA34
|
LCA14, LCG14 |
LFA24, LFH24, LCA24 , LFA34 |
|
|
|
|
Type |
LCA14
LCG14 |
LFA24
LCA24 |
LFH24 |
LFA34 |
| Size |
1.6×0.8 |
2.0×1.25 |
2.0×1.0 |
3.2×1.6 |
|
A |
2.2 |
2.6 |
2.6 |
3.8 |
|
B |
1.2 |
1.5 |
1.5 |
2.5 |
|
C |
0.5 |
0.75 |
0.63 |
0.9 |
|
D |
1.4 |
1.85 |
1.73 |
2.6 |
|
E |
0.4 |
0.5 |
0.5 |
0.8 |
|
F |
0.15 |
0.25 |
0.25 |
0.45 |
|
G |
0.5 |
0.55 |
0.55 |
0.65 |
| H |
0.15 |
0.23 |
0.23 |
- |
|
|
Series |
Soldering conditions |
LFA10*1
LCA10*1
LCA20*1
LFA20
LFA30
LCA14*1
LCG14*1
LFA24*1
LFH24*1
LCA24*1
LFA34*1
LFB10*1
LFB20
LFB30
LZA05
LZA10
CMA12*1
CMB12*1
|
| 1) |
Time shown in the above figures is
measured from the point when chip surface
reaches temperature. |
| 2) |
Temperature difference in high temperature
part should be within 100°C. |
| 3) |
After soldering, do not force cool,
allow the parts to cool gradually. |
|
|
| 1) |
Time shown in the above figures is
measured from the point when chip surface
reaches temperature. |
| 2) |
Temperature difference in high temperature
part should be within 110°C. |
| 3) |
After soldering, do not force cool,
allow the parts to cool gradually. |
|
*1 LFA10,LCA10,LCA20,LCA14,LCG14,LFA24,LFH24,LCA24,LFA34,LFB10,CMA12,CMB12 are reflow only.
|
<General attention to soldering>
| • |
High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change of characteristic may occur.
|
| • |
For soldering, please refer to the soldering curves above.
However, please keep exposure to temperatures exceeding 200ºC to under 50 seconds. |
| • |
Please use a mild flux(containing less than 0.2wt% C ). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components, that could affect resistance. |
<Cleaning>
When using ultrasonic cleaning, the board may resonate if the output
power is too high. Since this vibration can cause cracking or a decrease
in the adherence of the termination, we recommend that you use the conditions
below.• Frequency:40kHz max.
• Output power:20W/Liter
• Cleaning time:5minutes max.
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