FH05 and FH10 SERIES

Dimensions (mm)

Specifications

• Operating temperature range・・・・・・・・・・・
-40℃ ~ +125℃
• Heat dissipation ・・・・・・・・・・・・・・・・・・・・・・・
FH05: 0.15mW/℃
FH10: 0.30mW/℃
 
• Maximum power dissipation・・・・・・・・・・・・
FH05: 15mW
FH10: 30mW

*Heat and maximum power dissipation when thermistor is soldered to φ0.1mm CuNi wire.

Features

• Extremely small and precise
• Maintains accuracy for its long life
• Excellent solderability and bondability
• Excellent stability during AuSn soldering process (≈ 300℃)

Characteristics

FH05 and FH10 Series

Part Number
Resistance
R25
Resistance Tolerance
B25/50 Value
R-T Data
± 1%
± 2%
± 3%
PDF CSV
FH05-6D103*C
10kΩ
3930K
FH10-6E103*C
10kΩ
3950K
FH10-6Q103*C
10kΩ
3410K
FH10-3U104*C
100kΩ
3950K
* Tolerance (F = ± 1%, G = ± 2%, H = ± 3%)
• Please consult us for availability of values not shown here.

Recommended Soldering Profile

FH Series Au/Sn Solder mounting
Solder: Au/Sn (79/21) Preform
Mounting device: Die bonder
N2 flow: 3L/min
Mounting temperature: 320℃

 

1) Please keep exposure to temperature exceeding 280℃ to under 10seconds.
2) After soldering allow parts to cool gradually and do not force-cool them.

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