■Recommended Land Pattern (Reference)
■Recommended Dolderring Conditions
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| Series |
Soldering conditions |
AHD *1
AMD *1 |
|
|
| |
*1 AHD,AMD are reflow only. |
|
|
General attention to soldering |
| • |
High soldering temperatures and long soldering times can cause leaching of
the termination, decrease in adherence strength, and the change of characteristic
may occur. |
| • |
For soldering, please refer to the soldering curves above.
However, please keep exposure to temperatures exceeding 200ºC to under 50 seconds.
|
| • |
Please use a mild flux(containing less than 0.2wt% Cl). Also, if the flux is
water soluble, be sure to wash thoroughly to remove any residue from the
underside of components, that could affect resistance.
|
|
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power
is too high. Since this vibration can cause cracking or a decrease in the
adherence of the termination, we recommend that you use the conditions
below.
Frequency:40kHz max.
Output power:20W/Iiter
Cleaning time:5minutes max. |
|
■Precautions
| • |
Operating temperature range
Operating temperature range : -25ºC ~ +85ºC
Storage temperature range : -25ºC ~ +85ºC |
| • |
Handling
Excessive stress or mechanical shock may damage to products, therefore,please be careful in handling or transporting products and assemblies with this product.
|
| • |
Storage
Products should be stored as it packaged (as sealed up) under normal temperature and humidity. To avoid degradation or destruction of products,please do not store under conditions below.
⋅In an atmosphere containing corrosive gas (SOx, NOx, Cl2, NH3 etc.)
⋅Dusty Place
⋅Humid place, where water condenses
|
|
Stored products should be used within 3 months of receipt (If once the seal of covertape is broken, please use immediately).
If this period is exceeded please verify solderability of products.
[Recommended storage condition]
Temperature : -10ºC~+40ºC
Humidity : 15%R.H~85%R.H |
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